Established in 1996, OSEP is a 550,000 sq. ft facility
in Laguna, Philippines employing 1,026 staff. Its
technology is focused on lead frame based packages
such as PDIP, SOIC, PLCC, SSOP, & TSSOP, MSL 1
for all SMD packages (qualified by customers), green
packaging, lead free plating process, and cratering
elimination. Customers rate OSEP as the company
with the best wire bond controls. The facility capacity
fully supports SOIC, PDIP, SOJ, PLCC and
SSOP/TSSOP.

To be the Leading Service Provider to all of our Customers' Packaging and Testing Needs.

OUR MISSION….

To Ensure Total Customer Satisfaction through Teamwork and Continuous Improvement, Driven by empowered employees in an Environment friendly and Community oriented Manufacturing Facilities, Resulting to Reasonable Returns to our Shareholders, Employees and Trade Partners